Flow Soldering jigs
We offer a wide variety of defect prevention measures, including fixing the board, preventing floating components, alignment, unsoldered parts, and bridge defects.
Specially processed anti-bridge plate
Solder Mounting
Solder Mounting Technology
We design and manufacture flow soldering jigs and reflow soldering jigs to meet customer needs. We solve problems using a variety of technologies, including special processing.
Reflow Soldering jigs
We can handle everything from thin rigid plates to thick materials with a variety of pallet types.
We fix the boards with various mechanisms such as tensile tension, silicone adhesion, and magnet retention, optimizing the mounting quality.
Reliability testing, analysis, and failure analysis
We offer a wide range of unique tests, from basic test analysis and evaluation such as cross-sectional analysis, component analysis, and various strength tests, to board warpage simulation and BGA package removal method (individual bond strength test). We also offer industry-leading equipment and expert analysis and analysis methods, and propose solutions to problems based on the results.
| test | measurement | analysis |
|---|---|---|
| Temperature cycle test Thermal shock test (hot oil) Temperature/humidity test High and low temperature storage tests Vibration/impact test salt spray test strength test Conductor peeling test Solvent resistance test Solder wettability test PCT Condensation cycle test insulation resistance test | 2/3D measurement Non-contact 3D measurement shape measurement roughness measurement laser measurement image measurement |
Elemental analysis (EDX, WDX) Auger analysis Atomic absorption spectrometry Fluorescence X-ray analysis Plasma Optical Emission Spectroscopy (ICT) FT-IR X-ray transparent observation X-ray CT observation TEM observation SEM observation FIB observation |